JPH0129063B2 - - Google Patents
Info
- Publication number
- JPH0129063B2 JPH0129063B2 JP59011044A JP1104484A JPH0129063B2 JP H0129063 B2 JPH0129063 B2 JP H0129063B2 JP 59011044 A JP59011044 A JP 59011044A JP 1104484 A JP1104484 A JP 1104484A JP H0129063 B2 JPH0129063 B2 JP H0129063B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- suction
- urethane foam
- suction piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 22
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims 5
- 235000012431 wafers Nutrition 0.000 description 55
- 238000000034 method Methods 0.000 description 6
- 238000005498 polishing Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157231A JPS60157231A (ja) | 1985-08-17 |
| JPH0129063B2 true JPH0129063B2 (en]) | 1989-06-07 |
Family
ID=11767041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59011044A Granted JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60157231A (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07264B2 (ja) * | 1987-08-10 | 1995-01-11 | 住友電気工業株式会社 | 半導体ウエハの貼付方法および装置 |
| US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
| KR100967222B1 (ko) | 2008-06-16 | 2010-07-05 | 정진황 | 이송챔버 및 기판이송방법 |
| JP5493633B2 (ja) * | 2009-09-18 | 2014-05-14 | 株式会社Ｓｕｍｃｏ | 研磨方法及びその装置 |
| US9355882B2 (en) * | 2013-12-04 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer module for bowed wafers |
| CN106826510A (zh) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | 一种晶片扫光工艺 |
-
1984
- 1984-01-26 JP JP59011044A patent/JPS60157231A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60157231A (ja) | 1985-08-17 |
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